MediaTek introduced the Dimensity 6300 SoC in the Dimensity 6000 series after the launch of the Dimensity 6100+ last year. It integrates an improved 5G modem that supports the 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and features MediaTek UltraSave 3.0+ technology to save power, just like the 6100+.

The chip has two large Arm Cortex-A76 cores at 2.4 GHz and six efficient Arm Cortex-A55 cores at 2 GHz. It promises up to 10% faster CPU performance than the previous generation and over 50% more GPU performance.

processor Dimension 6300 Dimensions 6100+ Dimension 6020
process TSMC N6 (class 6nm)
cpu 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz
memory LPDDR4x 2133MHz, UFS 2.2 (2 lanes)
camera 16MP+16MP, 108MP, Hardware MFNR, 3DNR, AI-FD
show 2520 x 1080 (Full HD+) at 21:9 120 Hz
Video decoding / Video encoding 2160p (2160 x 1080), h.264, h.265/HEVC 4K 30 fps
Graphics Arm Mali-G57 MC2
modem 2G / 3G / 4G / 5G Multimode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD/TDD, 5G FDD/TDD, GSM, TD-SCDMA, WDCDMA
connectivity Built-in dual-band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC

The first smartphone powered by Dimension 6300 The SoC is expected to be realme C65 5G, which should launch in India later this month, followed by other markets.

Author: Srivatsan Sridhar

Srivatsan Sridhar is a mobile technology enthusiast who is passionate about mobile phones and mobile applications. Use the phones you review as your primary phone. You can follow it Twitter e Instagram
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