MediaTek introduced the Dimensity 6300 SoC in the Dimensity 6000 series after the launch of the Dimensity 6100+ last year. It integrates an improved 5G modem that supports the 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and features MediaTek UltraSave 3.0+ technology to save power, just like the 6100+.

The chip has two large Arm Cortex-A76 cores at 2.4 GHz and six efficient Arm Cortex-A55 cores at 2 GHz. It promises up to 10% faster CPU performance than the previous generation and over 50% more GPU performance.

processor Dimension 6300 Dimensions 6100+ Dimension 6020
process TSMC N6 (class 6nm)
cpu 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz
memory LPDDR4x 2133MHz, UFS 2.2 (2 lanes)
camera 16MP+16MP, 108MP, Hardware MFNR, 3DNR, AI-FD
show 2520 x 1080 (Full HD+) at 21:9 120 Hz
Video decoding / Video encoding 2160p (2160 x 1080), h.264, h.265/HEVC 4K 30 fps
Graphics Arm Mali-G57 MC2
modem 2G / 3G / 4G / 5G Multimode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD/TDD, 5G FDD/TDD, GSM, TD-SCDMA, WDCDMA
connectivity Built-in dual-band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC
availability

The first smartphone powered by Dimension 6300 The SoC is expected to be realme C65 5G, which should launch in India later this month, followed by other markets.


Author: Srivatsan Sridhar

Srivatsan Sridhar is a mobile technology enthusiast who is passionate about mobile phones and mobile applications. Use the phones you review as your primary phone. You can follow it Twitter e Instagram
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